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Packaging of opto-electronic devices for flexible applications

Location:	USA
City:	San Francisco
Description:	SPIE Photonics West, Conference on Optical Interconnects: Integration and Packaging
Start Date:	23/01/2010
End Date:	28/01/2010
Authors:	E. Bosman, G. Van Steenberge, J. Missinne, B. Van Hoe , P. Van Daele