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Fully embedded optical and electrical interconnections in flexible foils

Location:	Italy
City:	Rimini
Description:	European Microelectronics and Packaging Conference
Start Date:	15/06/2009
End Date:	18/06/2009
Authors:	E. Bosman, G. Van Steenberge, P. Geerlinck, J. Vanfleteren, P. Van Daele